Process Engineer I: Silicon Etch

RESPONSIBILITIES INCLUDE (BUT ARE NOT LIMITED TO):

• While working in a cleanroom environment, responsible for the development, implementation, and maintenance of robust manufacturing processes for micro-optical devices and similar products using semiconductor-related wafer fabrication technologies for plasma etching of silicon substrates.
• Responsible for performing in-line quality assurance processes and supporting continuous improvement.
• Responsible for supporting critical outsourced value creation process steps in production flow.
• Under the guidance of senior members of the technical staff, execute Design of Experiments to support the commercialization of the company technology.
• Create and maintain documentation required to support production.

RESPONSIBILITIES (CONTINUED):

• Provide sustaining support of the production area. Perform troubleshooting and root cause analysis of out of control and out of spec conditions. Implement corrective actions to prevent their reoccurrence.
• Resolve process-related problems affecting cycle time, yield, and tool availability.
• Help drive process improvements and continuous improvement initiatives.
• Demonstrate proficiency in oral and written communication, presentation, and reporting skills, and data analysis and problem solving.
• Effectively interface with all levels of the organization.
• Utilize a cross-functional approach to problem solving, working with all available manufacturing resources to achieve company goals.

RESPONSIBILITIES (CONTINUED):

• Monitor process and equipment performance by analyzing inline SPC data.
• Actively support continuous improvement, TPM, cycle time reduction, and yield enhancement initiatives.
• Assist in the development of manufacturable production flows for new products.
• Understand and comply with all company safety policies and procedures.  Demonstrate ability to follow safety procedures in the operation of equipment and processes.  Demonstrate safe and correct handling procedures for chemicals used in production processes.  Wear protective equipment as specified in procedures.
• Demonstrate proper cleanroom protocol.
• Support daily productivity and quality goals.  Complete assigned tasks in acceptable time limits of quality, quantity, and timeliness of completion.  Make sure all pertinent documentation is recorded accurately and legibly.  Perform accurate data entry in JOSH (internal system).
•  Performs all other duties as assigned by supervisor.

REQUIREMENTS:

• 1-2 years’ silicon plasma etch processing and development experience in a semiconductor or MEMS (micro-electro-mechanical systems) facility.
• BS or MS Degree in Chemistry, Physics, Materials, Chemical Engineering, Electrical Engineering or related engineering discipline.
• In compliance with federal law, all persons hired will be required to verify identity and eligibility to work in the United States and to complete the required employment eligibility verification form upon hire.

PHYSICAL REQUIREMENTS:

The physical requirements described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

While performing the duties of this job, the employee is occasionally required to stand; walk; sit; use of hands or fingers to handle, or feel objects, tools or controls and keyboarding; reach with hands and arms; climb stairs; balance; stoop, kneel, crouch or crawl; talk and hear.

The employee must occasionally lift and/or move up to 75 pounds. Specific vision abilities required by the job include close vision, distance vision, color vision, peripheral vision, depth perception, and the ability to adjust focus.