Fab Engineer, Etch, 2nd shift

RESPONSIBILITIES INCLUDE (BUT ARE NOT LIMITED TO):

• Responsible manufacturing micro-optical devices and similar products using semiconductor related wafer fabrication processes, including photolithography, plasma etching, wet etching, metrology and inspection.
• The Fabrication Process Engineer will report directly to the Engineering n Manager, supporting fabrication in general production and product development, and quality teams.

The employee must:

• Work in a strong team environment
• Follow procedures that are in place and being utilized for completing orders, support LEAN manufacturing and continuous improvement, rigorous adherence to safety protocols
• Work using excellent communication with supervisors, technicians, process, quality  engineers;
• Use semiconductor fabrication procedures including wafer preparation, photoresist processing including photolithography processing, plasma etching, vacuum system processing, surface topology metrology, inspection techniques, wafer dicing.
• Key success criteria - customer satisfaction as measured by product quality and on-time shipment metrics
• Set up, process, measure, inspect, and report during fabrication process, be PC proficient with standard tools (spread sheets, word processing), perform accurate data recording/entry and analysis
• Operate manual and automated semiconductor fabrication equipment;
• Performs all other duties as assigned

REQUIREMENTS:

• H.S. Diploma or equivalent, Associate Degree or higher level education, preferred.
• Preferred: At least two years in semiconductor or related manufacturing (Integrated circuit manufacturing, micro-optics manufacturing, MEMS manufacturing, compound semiconductor manufacturing )
• Preferred: 1 year prior experience operating in class 1000 clean room, and clean room protocol.
• Detail oriented, and be driven to excellence, demonstrate excellent workmanship, good dexterity for handling high value, very fragile wafers and components;
• Familiarity with optical inspection techniques to military or ISO standards;
• Direct experience with the handling and processing of optical quality glass, wafer materials;
• Strong written and oral communications skills;  
• In compliance with federal law, all persons hired will be required to verify identity and eligibility to work in the United States and to complete the required employment eligibility verification form upon hire.